Mr. Chenjun Li — Chairman of the Board of Directors and Co-Ceo

Mr. Li has more than 10 years of experience in credit card and credit card related systems, and 8 years of experience in blockchain-oriented ASIC and other blockchain application technologies. Most recently, Mr. Li was the Chief Technology Officer at Shenzhen HighSharp Electronics Ltd., leading the R&D of SMIC and TSMC high-performance ASIC, and the entire solutions of ASIC development. Previously, he worked at Shanghai Huateng Software System Co., Ltd. and Tonglian Payment Network Service Co., and earned his bachelor’s degree in computer science and technology from Tongji University. Mr. Li has extensive experience in FinTech and high-performance ASIC fields.